
Custom Headlight LED Driver Board OEM
A representative headlight driver board case from TECOO, showcasing our capability in manufacturing multi-layer control PCBA for automotive headlamp systems. Engineered for stable DC-DC conversion, beam control, and long-term thermal reliability — produced to order, not stocked.
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Product Introduction
Note: This board is a capability showcase example, not an in-stock item. All driver boards are manufactured to order based on customer Gerber files and BOM.
Technical Parameters
| Board Type | Multi-layer FR-4 (High-TG) or Metal Core PCB |
| Layers | 2-6 Layers (up to 8 for complex logic) |
| Board Thickness | 1.0mm - 1.6mm |
| Copper Thickness | 1oz - 2oz |
| Surface Finish | ENIG / HASL Lead-Free / OSP |
| Assembly Type | Double-sided SMT + Through-Hole (THT) |
| Circuit Functions | Constant-current LED driver, DC-DC conversion, beam control logic |
| Operating Voltage | DC 9V - 16V / 12V - 24V |
| Standards | IPC-A-610 Class 3 |
Materials
- Laminate: High-TG FR-4 or high-frequency materials for signal integrity.
- Thermal Interface: Thermal pads and gap fillers for driver ICs.
- Components: AEC-Q certified ICs, MOSFETs, capacitors, and connectors.
- Protection: Conformal coating for moisture and vibration resistance.
Application Scenarios
- LED headlamp driver and control modules.
- Adaptive Front-lighting Systems (AFS) and matrix beam controllers.
- High/low beam and DRL integrated driver boards.
- Automotive lighting retrofit and aftermarket driver modules.
Capability Advantages
- Complex Board Expertise: Proven capability in multi-layer, high-density control PCBA.
- Design Support: PCB layout, DFM analysis, and EMI/EMC layout guidance.
- Advanced Inspection: 3D AOI and 3D X-Ray for high-density interconnect verification.
- Full Traceability: Component-level tracking to meet automotive safety standards.
- 24-Year Track Record: Reliable EMS partner across industrial and automotive sectors.
FAQ
Q1: Is this driver board available for direct purchase?
A: No, it is a capability example. We manufacture custom driver boards based on your design files.
Q2: Can you handle multi-layer and double-sided assembly?
A: Yes, we support up to 8-layer boards with double-sided SMT and through-hole assembly.
Q3: Do you assist with EMI/EMC optimization?
A: Yes, our engineering team provides layout guidance and pre-compliance support.
Q4: What testing is performed?
A: 3D AOI, 3D X-Ray, and functional testing are standard for driver board production.
Developing a Headlight Driver Board? Send us your Gerber files and BOM for a free DFM analysis and a professional quote. Contact us today to discuss your project with our engineering team. [Request a Custom Quote]
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